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INTEGRATED CIRCUITS
DATA SHEET
TDA8722 I2C-bus programmable modulator for negative video modulation and FM sound
Product specification Supersedes data of 1995 Mar 21 File under Integrated Circuits, IC02 1998 Jun 23
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
FEATURES * Video amplifier with clamp and white clip circuits * FM sound modulator * Asymmetrical and symmetrical RF outputs available * Symmetrical RF oscillator using only a few external components * External adjusting of modulation depth and level of the sound subcarrier * I2C-bus receiver for frequency setting and test-mode selection * One I2C programmable output port * On-chip Phase-Locked Loop (PLL) frequency synthesizer * On-chip power supply regulator * Bus switchable oscillator * On-chip Test Pattern Signal Generator (TPSG). APPLICATIONS * Video recorders * Cable converters * Satellite receivers. ORDERING INFORMATION TYPE NUMBER TDA8722T TDA8722M PACKAGE NAME SO20 SSOP20 DESCRIPTION plastic small outline package; 20 leads; body width 7.5 mm plastic shrink small outline package; 20 leads; body width 4.4 mm GENERAL DESCRIPTION
TDA8722
The TDA8722 is a programmable modulator which generates an RF TV channel from a baseband video signal and a baseband audio signal in the event of negative video and FM sound standards (PAL B/G, I, D/K and NTSC). It is especially suited for satellite receivers, video recorders and cable converters. The video carrier frequency is set exactly to the correct channel frequency by a PLL synthesizer which is programmed in accordance with the I2C-bus format.
VERSION SOT163-1 SOT266-1
1998 Jun 23
2
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
TDA8722
QUICK REFERENCE DATA VDDA = VDDD = 5 V; Tamb = 25 C after the IC has reached thermal equilibrium; unless otherwise specified. SYMBOL VDDA VDDD IDD m P/S VRF f Notes 1. Value depends on value of resistor R17 (see Fig.7). 2. Value depends on value of capacitor C17 (see Fig.7). PARAMETER analog supply voltage digital supply voltage total supply current typical modulation depth range typical picture-to-sound level range RF output voltage level asymmetrical on a 75 load FM deviation on audio subcarrier normal mode video level (pin 19) = 0.5 V (p-p); note 1; see Fig.10 note 2; see Fig.11 frequency between 471.25 and 855.25 MHz fi = 400 Hz; V1 = 0.5 V (RMS); before pre-emphasis filter CONDITIONS MIN. 4.5 4.5 41 65 -18 77 20 TYP. 5.0 5.0 52 - - 80 25 MAX. 5.5 5.5 63 90 -10 83 30 UNIT V V mA % dB dBV kHz
1998 Jun 23
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Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
BLOCK DIAGRAM
TDA8722
handbook, full pagewidth
VIDEO 19 CLAMP
ADJUST 17
AGND 18
VDDA 20
RFA 16
RFB 15
TDA8722
VIDEO AMP
VOLTAGE REGULATOR
ASYMMETRICAL OUTPUT BUFFER
CLIP AUDIO SOSCA SOSCB 1 2 3 AUDIO FM MODULATOR TPSG on balance test 13 I 2C-BUS RECEIVER 10 bits enable/ select f DIV LOGIC f ref PHASE DETECTOR enable CHARGE PUMP
AMP
TPSG
SWITCH
MIXER
PC 6 5 4 UOSCA OGND UOSCB
SDA
SCL
12
12-BIT DIVIDER (N)
PRESCALER (8)
UHF OSCILLATOR
P0
14
RF oscillator on
8 CP 7 AMP
31.25 kHz 11 VDDD 10 DGND
DIVIDER (M = 128)
4 MHz OSCILLATOR
9
XTAL
MBE401
Fig.1 Block diagram.
1998 Jun 23
4
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
PINNING SYMBOL PIN AUDIO SOSCA SOSCB UOSCB OGND UOSCA AMP CP XTAL DGND VDDD SCL SDA P0 RFB RFA ADJUST AGND VIDEO VDDA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 audio input sound oscillator A sound oscillator B UHF oscillator B RF oscillator ground UHF oscillator A tuning amplifier output charge pump output crystal oscillator digital ground digital supply voltage serial clock input (I2C-bus) serial data input (I2C-bus) NPN open-collector output Port asymmetrical RF output B asymmetrical RF output A modulation depth and picture-to-sound distance adjustment pin analog ground video input analog supply voltage Fig.2 Pin configuration.
SOSCA SOSCB UOSCB OGND UOSCA AMP CP XTAL 2 3 4 5
handbook, halfpage
TDA8722
DESCRIPTION
AUDIO
1
20 VDDA 19 VIDEO 18 AGND 17 ADJUST 16 RFA
TDA8722
6 7 8 9 15 RFB 14 P0 13 SDA 12 SCL 11 VDDD
MBE394
DGND 10
FUNCTIONAL DESCRIPTION The TDA8722 is a programmable modulator which can be divided into two main blocks: * A modulator for negative video modulation and FM sound TV standards * A programmable PLL frequency synthesizer. The video part of the modulator consists of a clamping circuit which sets the internal reference voltage to the bottom of the synchronizing pulse, followed by a white clip which avoids over modulation in case the video signal is too strong. Typically, the IC starts to clip the video signal when the voltage at the video input (pin 19) is >560 mV (p-p) while the normal voltage at the video input is 500 mV (p-p). This clipping function ensures that the video modulation depth is not too high. The modulation depth is adjusted in the application between at least 65 and 90% by changing the resistor value between pin 17
and ground (R17). The value can change between 47 k and infinite (R17 removed); see Fig.10. The video part also contains a test pattern signal generator to simplify the adjustment of the receiving channel of the TV set to the required channel of the modulator. The pattern consists of a synchronization pulse and two vertical white bars on screen (see Fig.3). The audio part of the modulator contains an FM sound modulator. The frequency of the sound subcarrier is set in the application by external components (C3, L3 and R3). The difference between the video carrier level and the sound subcarrier level is adjusted in the application by changing the value of the capacitor between pin 17 and ground (C17). The value can change between 0 and 47 pF. The distance between the video carrier and the sound subcarrier can be adjusted between at least -10 and -18 dB (see Fig.11).
1998 Jun 23
5
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
To bias the audio input it is necessary to put a resistor in the application between pin 1 and ground. The resistor has a typical value of 12 k. The RF part of the oscillator consists of: * An oscillator which operates at the required video carrier frequency. The range of the oscillator is determined in the application by C5, C6, L5 and D5. * An RF mixer. It first combines the video signal and the sound subcarrier to build a baseband TV channel. Then the baseband signal is mixed with the oscillator signal to get the RF TV channel. The mixer has two outputs which can be used as two independent asymmetrical outputs, or as one symmetrical output. In the event of asymmetrical use, the unused output must be loaded with a 75 resistor (see Fig.7). The oscillator frequency is set by a programmable PLL frequency synthesizer in accordance with equation: fosc = 8 x N x fref Where: fosc is the local oscillator frequency.
TDA8722
N is a 12-bit dividing number (10 bits are programmable by the I2C-bus). fref is the crystal frequency (4 MHz) divided by 128 (31.25 kHz). The circuit allows a step of 250 kHz but because only 10 bits are programmable, the programming steps are 1 MHz. When the PLL loop is locked, both inputs of the phase comparator are equal, which gives equation: f osc f xtal f DIV = ------------- = --------- = f ref 8xN 128 During the test mode operation, fDIV and fref can be monitored on the output Port pin (pin 14). Software information The synthesizer is controlled via a two-wire I2C-bus receiver. For programming, the address byte (C8 HEX) has to be sent first. Then one or two data bytes are used to set the 10 programmable bits of the dividing number N, the test bits (see Table 1) and the output Port state. Note that after power-up of the IC, the two data bytes must be sent.
handbook, full pagewidth
MBE395
0
10
20
30
40
50 t (s)
60 64
70
Fig.3 Test pattern signal.
1998 Jun 23
6
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
Table 1 Data format; notes 1 and 2 BYTE Address byte C8 Data byte 1 Data byte 2 Notes 1. The 10 programmable bits of N are: b2 to b11. 2. Internal hardware sets: b1 = 0 and b0 = 1. 3. T0, T1 and T2 are bits used for test purposes (see Table 5). 4. P0 is a bit used for controlling the state of the output Port (see Table 6). Table 2 Structure of the dividing number N BITS(1) RESULT b11 Frequency (MHz)(3) Notes 512 b10 256 b9 128 b8 64 b7 32 b6 16 b5 8 b4 4 b3 2 b2 1 BIT 7 MSB 1 0 1 BIT 6 1 b11 T0(3) BIT 5 0 b10 T1(3) BIT 4 0 b9 T2(3) BIT 3 1 b8 P0(4) BIT 2 0 b7 b4 BIT 1 0 b6 b3 BIT 0 LSB 0 b5 b2
TDA8722
ACKNOWLEDGE BIT ACK ACK ACK
b1(2) 0.5
b0(2) 0.25
1. Bits b2 to b11 are programmable and represent the integer part of the frequency in MHz. Bits b1 and b0 are fixed internally to b1 = 0 and b0 = 1 to get the added 0.25 MHz, common for most TV channels. 2. Bits b1 and b0 are not programmable. 3. fosc = 512b11 + 256b10 + 128b9 + 64b8 + 32b7 + 16b6 + 8b5 + 4b4 + 2b3 + b2 + 0.25 (MHz). Table 3 Dividing number N for programming channel 21 (471.25 MHz) BITS RESULT b11 Value Frequency Notes 1. Bits b1 and b0 are not programmable. 2. fosc = 0 + 256 + 128 + 64 + 0 + 16 + 0 + 4 + 2 + 1 + 0.25 (MHz) = 471.25 MHz. Table 4 Content of the data bytes to program channel 21 (471.25 MHz) BYTE Address byte C8 Data byte 1 Data byte 2 BIT 7 MSB 1 0 1 BIT 6 1 0 0 BIT 5 0 1 0 BIT 4 0 1 0 BIT 3 1 1 0 BIT 2 0 0 1 BIT 1 0 1 1 BIT 0 LSB 0 0 1 ACKNOWLEDGE BIT ACK ACK ACK (MHz)(2) 0 0 b10 1 256 b9 1 128 b8 1 64 b7 0 0 b6 1 16 b5 0 0 b4 1 4 b3 1 2 b2 1 1 b1(1) 0 0 b0(1) 1 0.25
It is possible to change only one data byte. The circuit will recognize which one is received with the value of MSB (0 for data byte 1 and 1 for data byte 2). It is possible to change the frequency by 1 MHz with data byte 2. It is easy to increment the channel frequency when its frequency width is 8 MHz by simply incrementing data byte 1. 1998 Jun 23 7
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
The bits T0 to T2 are available for test purposes and the possibilities are shown in Table 5. Table 5 T0 0 0 0 0 1 1 1 1 Notes Test modes T1 0 0 1 1 0 0 1 1 T2 0 1 0 1 0 1 0 1 normal operation Test Pattern Signal Generator (TPSG) on; note 1 RF oscillator off; note 2 balance test; note 3 fref out (if p0 = 0); note 4 high-impedance test; note 5 fDIV out (if p0 = 0); note 4 phase detector disabled; baseband signals on RF outputs; note 6 OPERATIONAL MODE
TDA8722
1. In `TPSG on' mode the video carrier is modulated by the test signal consisting of a synchronization pulse and two vertical white bars on a black screen. This mode should be selected to adjust the TV set receiving the modulated signal to the right frequency. 2. In `RF oscillator off' mode, the RF oscillator and the RF mixer are switched-off and there is no RF carrier coming out of the device. This mode can be selected to avoid RF radiation to other parts when the modulator output is not used. 3. In `balance test', the video carrier is over modulated. This simplifies residual carrier measurements. 4. In `fref' and `fDIV' modes, the reference frequency fref in the phase comparator or the divided RF oscillator frequency fDIV is available on the output Port pin. This mode requires that bit P0 = 0. 5. The `high-impedance test' mode may be used to inject an external tuning voltage to the RF tank circuit, to test the oscillator. In this mode, the phase detector is disabled and the external transistor of the tuning amplifier is switched-off. The AMP output (pin 7) is LOW (<200 mV). 6. In the `phase detector disabled' mode, it is possible to measure the leakage current at the input of the tuning amplifier, on the CP pin. In this mode the RF oscillator is off, and the baseband TV channel signal is present on the RF outputs for testing the audio and video parts. The possibilities of bit P0, which controls the output Port (pin 14) are given in Table 6. The Port is an NPN open-collector type. For monitoring the fref or fDIV frequency on the output Port, the P0 bit must be logic 0 to let the output Port free. Table 6 P0 0 1 Output Port programming OUTPUT PORT STATE off; high impedance on; sinking current
1998 Jun 23
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Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDDA VDDD VDD Vmax Tstg Tamb HANDLING analog supply voltage digital supply voltage operating supply voltage maximum voltage on all pins IC storage temperature operating ambient temperature PARAMETER MIN. -0.3 -0.3 4.5 -0.3 -40 -20 +6 +6 5.5 VDD +125 +85
TDA8722
MAX. V V V V C C
UNIT
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it is desirable to take normal precautions appropriate to handling integrated circuits. Every pin withstands the ESD test in accordance with "MIL-STD-883C category B" (2000 V). Every pin withstands the ESD test in accordance with Philips Semiconductors Machine Model (MM) 0 , 200 pF (200 V). THERMAL RESISTANCE SYMBOL Rth j-a SO20; SOT163-1 SSOP20; SOT266-1 PARAMETER thermal resistance from junction to ambient in free air 85 120 K/W K/W VALUE UNIT
1998 Jun 23
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Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
CHARACTERISTICS VDDA = VDDD = 5 V; Tamb = 25 C; valid over the whole UHF band; measured in circuit of Fig.7; unless otherwise specified. SYMBOL Supply IDD supply current normal mode RF off test mode Video characteristics I19 z19 m input current (AC) video input impedance modulation depth V19 = 3.2 V V19 = 3.2 V - 30 0.5 - 82 41 30 52 38 PARAMETER CONDITIONS MIN. TYP.
TDA8722
MAX.
UNIT
63 46
mA mA A k %
2.0 - 87
V19 = 500 mV (p-p) EBU 77 colour bars; R17 = 120 k; see Fig.7 during clipping condition; note 1 TPSG mode; R17 = 120 k balance test mode; R17 = 120 k 85 72 110 65
- 82 - -
98 92 - 90
% % % %
m
modulation depth range
V19 = 500 mV (p-p) EBU colour bars; 47 k R17 referenced to the value for APL = 50%; V19 = 500 mV (p-p) video level on pin 19; note 2 fRF < 700 MHz; note 3 fRF > 700 MHz; note 3 note 4 note 4 V19 = 500 mV (p-p); V/S = 7/3 note 5
mAPL
variation of modulation depth with change of APL between 10 and 90% video input level where clipping starts (peak-to-peak value)
-2
-
+2
%
Vclip(p-p)
- 48 46 -8 -8
0.56 52 50 - -
- - - +8 +8 7.1/2.9 +1 - 30
V dB dB % deg
S/N video video signal-to-noise ratio Gdiff diff V/S fvideo Z1 m differential gain differential phase video-to-sync ratio frequency response for the video signal
6.9/3.1 7/3 -1 - - 25
dB
Audio characteristics (for PAL G standard; audio subcarrier at 5.5 MHz) audio input impedance modulation deviation f1 = 400 Hz; V1 = 0.5 V (RMS) before pre-emphasis filter f1 = 400 Hz; V1 = 2.0 V (RMS) before pre-emphasis filter f1 = 1 kHz; V1 = 0.5 V (RMS) before pre-emphasis filter 10 30 20 k kHz
mmax
maximum modulation deviation
60
85
-
kHz
THD
total harmonic distortion
-
0.4
1.5
%
1998 Jun 23
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
SYMBOL faudio P/S PARAMETER note 6 note 7 no audio signal; FM = 5.5 MHz; C17 = 15 pF no audio signal; FM = 5.5 MHz; 0 pF C17 39 pF frequency response of the audio signal picture-to-sound ratio CONDITIONS MIN. 45 -1 -16 - -13 TYP. 50
TDA8722
MAX. - +1 -10
UNIT dB dB dB
S/N audio audio signal-to-noise ratio
P/S
picture-to-sound ratio range
-18
-
-10
dB
Channel characteristics fRF VRF RF frequency range output level on RFA and RFB using tank circuit of Fig.7 asymmetrical output loaded with 75 ; f = 471.25 to 855.25 MHz measurement is made during synchronization pulse for the modulated carrier note 8 fRF = 471.25 MHz fRF = 855.25 MHz fs = 5.5 MHz; C17 = 15 pF; fRF < 700 MHz fs = 5.5 MHz; C17 = 15 pF; fRF > 700 MHz SCth fref IM sound carrier third harmonic level video signal harmonics reference frequency spurious chrominance beat fs = 5.5 MHz; C17 = 15 pF note 9 fp + 31.25 kHz note 10 471.25 - 77 80 855.25 MHz 83 dBV
VRF
difference between the level of modulated carrier and the level of the unmodulated carrier spurious outside channel RF second harmonic level on asymmetrical output sound carrier second harmonic level
0
1
2
dB
SPO RFsh SCsh
- - - -
-62 -30 -20 -65
- -25 -15 -60
dBc dBc dBc dBc
-
-63
-58
dBc
- - - - -
-65 -60 -65 -65 100 - -
-60 -55 -60 -60 - 2.5 10
dBc dBc dBc dBc A V nA
Charge pump output (CP) I8 V7 IOZ output current output voltage OFF-state leakage current in lock VCP = 2 V; T0 = 1; T1 = 1; T2 = 1 VCP = 2 V; IAMP = 10 A VCP = 0 V; T0 = 1; T1 = 0; T2 = 1 1.5 -
Amplifier output (AMP) G V7sat amplifier current gain output saturation voltage - - 4000 140 - 200 mV
Crystal oscillator characteristics (XTAL) Z9 oscillator input impedance - - -500
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Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
SYMBOL PARAMETER CONDITIONS - - - MIN. TYP.
TDA8722
MAX.
UNIT
Output Port characteristics (P0) VOL IOZ I14(max) LOW level output voltage OFF-state leakage current maximum Port current P0 = 1; I14 = 5 mA P0 = 0; VDD = 5.5 V P0 = 1 150 - - - - - - - 400 10 10 mV A mA
I2C-bus receiver characteristics (SDA and SCL) VIH VIL IIH IIL Vo Notes 1. Modulation depth when the video signal is between 560 and 1000 mV (peak-to-peak value) at pin 19. R17 = 120 k in the application. 2. For application information only. 3. Ratio between the CCIR 17 line bar amplitude (corresponding to the level difference between black and white; see Fig.4 and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after demodulation for PAL G standard. Measurement is unweighted, done between 200 kHz and 5 MHz. 4. Measured for PAL G standard on 4 first steps of CCIR 330 line, corresponding to a 5 step staircase with 300 mV (peak-to-peak value) chrominance carrier when the level between synchronization pulse and white is 1 V; see Fig.5. 5. Measured with a spectrum analyzer with `peak hold' function, applying a 500 mV (peak-to-peak value) sine wave at the video input of the IC, with a frequency of 0.5, 2.0, 4.0 and 4.8 MHz. The reference is the value measured for 1.0 MHz. 6. Measured using CCIR 468-3 weighting filter and quasi-peak detection, with an audio frequency of 1 kHz and a deviation of 50 kHz. Video signal is EBU colour bars of 500 mV (peak-to-peak value) on pin 19. 7. Measured in PAL G standard with no pre-emphasis on the audio input and no de-emphasis in the receiver. Audio input level is adjusted for having a deviation of 25 kHz at 1 kHz audio frequency. Measurement is done for frequencies between 50 Hz and 15 kHz, reference is the level measured for 1 kHz. 8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator frequency and the sound oscillator frequency (fRF + 2fs, 2fRF + fs, etc.). This measurement includes the spurious at the 14fRF, 12fRF and 34fRF. 9. Corresponding to the harmonics of the video signal. Measured by putting a 1 MHz sine wave of 500 mV (peak-to-peak value) at the video input (pin 19) and checking the level at fRF + 2 MHz, fRF + 3 MHz, etc. 10. Measured with a 4.43 MHz sine wave of 350 mV (peak-to-peak value) at the video input. Measurement is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency of the picture carrier plus 1.07 MHz. C17 = 15 pF in the application diagram of Fig.7. HIGH level input voltage LOW level input voltage HIGH level input current LOW level input current output voltage on SDA VIH = 5 V; VDD = 0 or 5 V VIL = 0 V; VDD = 0 or 5 V during acknowledge pulse; IIL = 3 mA 3 0 - -10 - 5.5 1.5 10 - 0.4 V V A A V
1998 Jun 23
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Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
TDA8722
handbook, full pagewidth
MBE396
1V
0.3 V
0V 0 10 20 30 40 50 t (s) 60 64 70
Fig.4 CCIR insertion line N.17.
handbook, full pagewidth
MBE397
1V
0.3 V
0V 0 10 20 30 40 50 t (s) 60 64 70
Fig.5 CCIR insertion line N.330.
1998 Jun 23
13
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
INTERNAL PIN CONFIGURATION
TDA8722
handbook, full pagewidth
VOLTAGE REGULATOR
20
V
DDA
AUDIO
1
19 2
VIDEO
SOSCA
18 SOSCB 3
AGND
UOSCB
4
17
ADJUST
16
RFA
OGND
5
15
RFB
UOSCA
6 14 P0
AMP
7
13 CP 8
SDA
9 XTAL 12 DGND 10 11
MBE402
SCL V DDD
ESD protection components are not shown in the diagram.
Fig.6 Pin equivalent circuit for each pin.
1998 Jun 23
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Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
APPLICATION INFORMATION
TDA8722
handbook, full pagewidthR20
VIDEO
470
100 nF C19
RF 75
R15
R18 82
R19 470
15 pF 100 nF C20 20 19 18 C17
75 R17 120 k
100 pF C16 100 pF C15
PORT
1 k R14
SCL SDA
17
16
15
14
13
12
11 10 nF C11
Q9 4 MHz
TDA8722
27 pF 1 2 3 4 5 L5 (2) K1
(1)
6
7
8
9
10
C9
C3 56 pF R3
33 pF C5
D5
33 pF C6
150 nF C8 R8 12 k R9 33 V
AUDIO
C1 220 pF R1 220 k
BB215 R5 22 k R6 22 k R7
15 k
L3
(3)
22 k
5V C30 10 nF T8 BC547B
MBE403
R4 220
R2 12 k
15 H (4) 10 nF C7
12 k
C31 2.2 F
C21 2.2 F
K2
GND
(1) (2) (3) (4)
K1: switches the pre-emphasis filter on or off. L5: air coil; 1.5 turns; diameter of 2 mm. L3: to adjust the application to the right sound carrier frequency (5.5 MHz for PAL G). K2: Switches the FM sound oscillator on or off.
Fig.7 Reference measuring set-up.
1998 Jun 23
15
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
Application design
TDA8722
handbook, full pagewidth
VIDEO
R20 470
100 nF C19
RF 75
R15
R18 82
R19 470
75
100 k RV1 (1) 15 pF C17 19 18 17 16 15 14 13 12 11 Q9 10 nF C11 27 pF 4 MHz PORT 82 k R17 100 pF C16 100 pF C15 SCL SDA
100 nF C20
5V
20
TDA8722
1
2
3
4 L5
5
6
7
8
9
10
C9
C3 56 pF R3
33 pF C5
D5
33 pF C6
150 nF C8 R8 12 k R9
AUDIO
C1 220 pF R1 220 k
R2 12 k
BB215 R5 22 k R6 22 k R7
33 V
15 k
L3 15 H
22 k
12 k
10 nF C7 T8 BC547B
C30 10 nF
MBE405
GND
(1) RV1 allows fine adjustment of the modulation depth between 70 and 90%.
Fig.8 Application using an asymmetrical output.
1998 Jun 23
16
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
TDA8722
handbook, full pagewidth
VIDEO
R20 470 R18 82
100 nF C19
RF 75
6 4 TR1 2 3 PORT TOKO - B4F 617DB - 1010
R19 470 R17 120 k
100 pF C16
1
100 nF C20
C17 15 pF
R15 300
100 pF C15
SCL SDA 5V
20
19
18
17
16
15
14
13
12
11 10 nF
Q9 4 MHz
TDA8722
C11 7 8 150 nF C8 33 pF C6 R8 12 k R9 33 V R6 22 k R7 9 10 27 pF C9
1
2
3
4 L5 33 pF C5
5
6
C3
AUDIO
C1 220 pF R1 220 k
R2 12 k
56 pF R3
D5
15 k
L3 15 H
BB215 R5 22 k 10 nF C7
22 k
12 k
T8 BC547B
C30 10 nF
MBE404
GND
Fig.9 Application using a symmetrical output with a balun transformer.
In the design of the application, it is highly recommended to separate the part of the RF oscillator as much as possible from the part of the RF outputs in order to avoid parasitic coupling between these two parts. A good solution is shielding the RF oscillator part to avoid radiation from and to this part. The pin 5 (OGND) must be connected to the shielding box and to ground. RF outputs For inexpensive applications, it is possible to use the IC with an asymmetrical output (pins 15 or 16). In this event, the unused output pin must be loaded with a load as 1998 Jun 23 17
similar as possible to the load connected to the used pin, see Fig.8. A good improvement in performance is obtained using a 1 : 4 symmetrical to asymmetrical transformer (balun; balance-to-unbalance) connected between the two outputs. In this event both outputs have their loads matched. The level of the RF second harmonic, and the spurious outside channel is decreasing. The parasitic coupling between RF outputs and RF oscillator is also reduced (see Fig.9).
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
Modulation depth With 500 mV (peak-to-peak value) video input signal, the wanted modulation depth must be set by the value of R17 (resistor between pin 17 and ground) as shown Fig.10. For a good accuracy, it is recommended to use a 1% type resistor. It is also possible to use an adjustable resistor, see Fig.8. Depending on the layout of the PCB, it may be necessary to slightly change the value of R17 from the one given in Fig.10 to get the wanted modulation depth. Sound oscillator design The frequency of the sound subcarrier is fixed by the tank circuit connected between pins 2 and 3. This frequency can be adjusted between 4.5 and 6.5 MHz covering all existing standards in the world. The damping resistor R3 between pins 2 and 3 is necessary to decrease the quality factor of the tank circuit allowing the frequency to be modulated by the audio signal. The value of this resistor is calculated for several Q factor ranges of the coil for a sound frequency of 5.5 MHz (see Table 7). Table 7
TDA8722
Value of resistor for several Q factor ranges PROPOSED VALUE FOR R3 (k) 82 to 33 33 to 27 27 to 22 22 to 18 18 to 15
COIL QUALITY FACTOR 30 to 40 40 to 50 50 to 60 60 to 80 80 to >100
The use of a coil with a quality factor <30 may result in a non operating oscillator. For safety, it is recommended to use a coil with a quality factor 50. Picture-to-sound ratio The picture-to-sound ratio can be adjusted in the application by changing the value of C17 (capacitor between pin 17 and ground); see Fig.11. Figure 11 shows us that the picture-to-sound ratio will change for a constant value of C17 when the sound subcarrier frequency will change. RF harmonics This IC has been designed to have the lowest level of unwanted RF harmonics at the frequencies where these are the hardest to be filtered out, especially for the second harmonic of the RF carrier at the lowest frequencies of the UHF band. The level of the second and third RF harmonic is shown in Fig.12 for an asymmetrical application. This chart gives a typical value while the level of these harmonics can vary depending on the design of the application. It is possible to reduce the level of the second harmonic by using a wide band transformer at the output of the IC and create a symmetrical application (see Fig.9). To reduce the out-of-band harmonics and especially the third one, it is necessary to use a low-pass filter at the output of the IC.
MBE398
handbook, halfpage
100
modulation depth (%) 90
80
70
60 10
102
R17 (k)
10 3
Fig.10 Typical modulation depth as a function of the value of R17.
1998 Jun 23
18
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
TDA8722
handbook, halfpage
8
MBE399
MBE400
handbook, halfpage
14
P/S (dB) 12
RF harmonics (dBc) 18 third harmonic
22
16
(1) (2) (3) (4)
26 second harmonic
20 0 R17 = 120 k. (1) 4.5 MHz. (2) 5.5 MHz. (3) 6.0 MHz. (4) 6.5 MHz. 10 20 30 C17 (pF) 40
30 450
550
650
750 850 RF (MHz)
Fig.11 Typical picture-to-sound ratio as a function of the value of C17.
Fig.12 Typical level of RF harmonics for an asymmetrical application.
VHF operation This IC can operate on frequencies as low as 200 MHz (and especially for VHF 3 band) provided the impedance of the tuned circuit between pins 4 and 6 is >1 k. NICAM and stereo Because of the fact that the ADJUST pin (pin 17) is an access point to the RF mixer, it is possible to use this pin to inject an external modulated subcarrier into the IC. This is especially interesting when it is necessary to transmit a second frequency modulated audio subcarrier for stereo sound (f = 5.72 MHz) or a NICAM QPSK modulated carrier for digital audio transmission (f = 5.85 or 6.552 MHz). The incoming signal must be externally modulated either in FM with the desired signal corresponding to PAL B/G specification for stereo sound transmission, or in QPSK in accordance with the NICAM transmission system.
The input impedance on pin 17 is approximately 3500 , the incoming signal must be capacitive coupled, the resistor R17 between pin 17 and ground must remain to adjust the modulation depth, the capacitor C17 between pin 17 and ground may be changed depending on the capacitance brought on by the incoming network. If this capacitance is large, it is possible to remove C17. Figure 13 shows a possible application for injecting such kind of signal into the modulator IC. Following this application, to get a picture-to-second sound carrier ratio of -20 dB, it is necessary to apply a level of approximately 800 mV (peak-to-peak value) at the second carrier input, when the picture-to-first sound carrier ratio is approximately -13 dB. In addition, the internal FM sound modulator can be switched off by short-circuiting pins 2 and 3.
1998 Jun 23
19
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
TDA8722
RF 75
handbook, full pagewidth
SECOND CARRIER
R15 75 R21 10 k R20 470 R18 82
10 pF C21 100 nF C19
VIDEO
R17 120 k
100 pF C16
100 pF C15
R19 470
100 nF C20
C17 PORT
20
19
18
17
16
15
14
TDA8722
MGC419
Fig.13 Possible application for a second sound subcarrier.
1998 Jun 23
20
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm
TDA8722
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 95-01-24 97-05-22
1998 Jun 23
21
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
TDA8722
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-04-05 95-02-25
1998 Jun 23
22
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering SO Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. SSOP
TDA8722
Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). METHOD (SO AND SSOP) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Jun 23
23
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8722
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1998 Jun 23
24
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
NOTES
TDA8722
1998 Jun 23
25
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
NOTES
TDA8722
1998 Jun 23
26
Philips Semiconductors
Product specification
I2C-bus programmable modulator for negative video modulation and FM sound
NOTES
TDA8722
1998 Jun 23
27
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545104/1200/02/pp28
Date of release: 1998 Jun 23
Document order number:
9397 750 03431

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